In 2012, TSMC admitted they could not beat Intel to FinFET. Instead, they maximized 28nm (yield and volume) while quietly building 16nm. The PDF shows a "tick-tock" roadmap (28nm -> 20nm -> 16nm) that allowed customers to design on stable nodes. Today, the same playbook applies to N7 -> N6 -> N5.
For engineers and strategists, studying this PDF is an exercise in understanding how to manage process transitions, customer expectations, and R&D risk. It remains a required reading for anyone looking to understand the DNA of the world’s most important semiconductor company. Tsmc Technology Symposium 2012 Pdf
: Successes were shared in BSI CMOS Image Sensors (BSI CIS) , smartcard technology, and 3D modular MEMS for motion sensors. In 2012, TSMC admitted they could not beat Intel to FinFET