| Condition | Target | Acceptable | Defect | |-----------|--------|------------|--------| | End overhang (width) | 0% | ≤ 25% of component width | > 25% | | Toe fillet height | Full solder wetting | Minimum equals solder thickness | No visible fillet | | Lifted component | No lift | N/A | Any visible lift |
You can purchase digital downloads or hard copies from authorized training centers like Soldertools.net for roughly $367.00 or SolderTraining.com for $305.00 ($214.00 for IPC members). ipc a 610 download
Released in late 2020, Revision H is the most current version. If you are performing an IPC A 610 download today, this is the file you need. Key updates in Revision H include: | Condition | Target | Acceptable | Defect
Revision G was the industry standard for several years. It introduced significant changes regarding the use of lead-free solder, off-grid component mounting, and clearer definitions of cleanliness. However, technology moves fast. With the rise of the Internet of Things (IoT) and high-density interconnect (HDI) boards, the G revision began to show its age regarding newer component packages. Key updates in Revision H include: Revision G